A low volume capability for the assembly of chips into Flat Packs, TO5 and Dual In-line packages is available using the following equipment:
- Dicing Saw (DAD 640) - Disco 8" wafer chuck
- Eutectic Die Attach - Dage-Precima Model EDB65 with mechanical scrub wetting
- Wire Bond - Kulicke & Soffa Model 472 gold wire ultrasonic ball bonder
- Disco 810 8" wafer grinder
Where devices may suffer degradation during eutectic die attach, low temperature processing is available using doped epoxy. Ultrasonic wire bonding provides the additional flexibility required for infrequent hybrid assembly jobs.
